A general Weibull model for reliability analysis under different failure criteria - Application on anisotropic conductive adhesive joining technology

10.1109/TEPM.2005.856539

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Bibliographic Details
Main Authors:	Liu, J., Cao, L., Xie, M., Goh, T.-N., Tang, Y.
Other Authors:	INDUSTRIAL & SYSTEMS ENGINEERING
Format:	Article
Published:	2014
Subjects:	Anisotropic conductive adhesive Failure criteria Flip-chip Reliability Weibull model
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/54199
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Institution:	National University of Singapore

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spelling	sg-nus-scholar.10635-541992023-10-30T07:34:09Z A general Weibull model for reliability analysis under different failure criteria - Application on anisotropic conductive adhesive joining technology Liu, J. Cao, L. Xie, M. Goh, T.-N. Tang, Y. INDUSTRIAL & SYSTEMS ENGINEERING Anisotropic conductive adhesive Failure criteria Flip-chip Reliability Weibull model 10.1109/TEPM.2005.856539 IEEE Transactions on Electronics Packaging Manufacturing 28 4 322-327 ITEPF 2014-06-16T09:28:37Z 2014-06-16T09:28:37Z 2005-10 Article Liu, J., Cao, L., Xie, M., Goh, T.-N., Tang, Y. (2005-10). A general Weibull model for reliability analysis under different failure criteria - Application on anisotropic conductive adhesive joining technology. IEEE Transactions on Electronics Packaging Manufacturing 28 (4) : 322-327. ScholarBank@NUS Repository. https://doi.org/10.1109/TEPM.2005.856539 1521334X http://scholarbank.nus.edu.sg/handle/10635/54199 000232942900006 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Anisotropic conductive adhesive Failure criteria Flip-chip Reliability Weibull model
spellingShingle	Anisotropic conductive adhesive Failure criteria Flip-chip Reliability Weibull model Liu, J. Cao, L. Xie, M. Goh, T.-N. Tang, Y. A general Weibull model for reliability analysis under different failure criteria - Application on anisotropic conductive adhesive joining technology
description	10.1109/TEPM.2005.856539
author2	INDUSTRIAL & SYSTEMS ENGINEERING
author_facet	INDUSTRIAL & SYSTEMS ENGINEERING Liu, J. Cao, L. Xie, M. Goh, T.-N. Tang, Y.
format	Article
author	Liu, J. Cao, L. Xie, M. Goh, T.-N. Tang, Y.
author_sort	Liu, J.
title	A general Weibull model for reliability analysis under different failure criteria - Application on anisotropic conductive adhesive joining technology
title_short	A general Weibull model for reliability analysis under different failure criteria - Application on anisotropic conductive adhesive joining technology
title_full	A general Weibull model for reliability analysis under different failure criteria - Application on anisotropic conductive adhesive joining technology
title_fullStr	A general Weibull model for reliability analysis under different failure criteria - Application on anisotropic conductive adhesive joining technology
title_full_unstemmed	A general Weibull model for reliability analysis under different failure criteria - Application on anisotropic conductive adhesive joining technology
title_sort	general weibull model for reliability analysis under different failure criteria - application on anisotropic conductive adhesive joining technology
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/54199
_version_	1781411947679318016

A general Weibull model for reliability analysis under different failure criteria - Application on anisotropic conductive adhesive joining technology

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