A general Weibull model for reliability analysis under different failure criteria - Application on anisotropic conductive adhesive joining technology

A general Weibull model for reliability analysis under different failure criteria - Application on anisotropic conductive adhesive joining technology

10.1109/TEPM.2005.856539

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Bibliographic Details
Main Authors: Liu, J., Cao, L., Xie, M., Goh, T.-N., Tang, Y.
Other Authors: INDUSTRIAL & SYSTEMS ENGINEERING
Format: Article
Published: 2014
Subjects:
Anisotropic conductive adhesive
Failure criteria
Flip-chip
Reliability
Weibull model
Online Access:http://scholarbank.nus.edu.sg/handle/10635/54199
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Institution: National University of Singapore
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