A general Weibull model for reliability analysis under different failure criteria - Application on anisotropic conductive adhesive joining technology
10.1109/TEPM.2005.856539
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Main Authors: | Liu, J., Cao, L., Xie, M., Goh, T.-N., Tang, Y. |
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Other Authors: | INDUSTRIAL & SYSTEMS ENGINEERING |
Format: | Article |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/54199 |
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Institution: | National University of Singapore |
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