Effect of Cu interfacial layer thickness on spin-injection efficiency in NiFe/Cu/graphene spin valves
10.1063/1.4807319
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Main Authors: | Zhang, C., Wang, Y., Wu, B., Wu, Y. |
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Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Article |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/55743 |
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Institution: | National University of Singapore |
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