Effects of microvoids on the linewidth dependence of electromigration failure of dual-damascene copper interconnects

Effects of microvoids on the linewidth dependence of electromigration failure of dual-damascene copper interconnects

10.1063/1.2714315

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Bibliographic Details
Main Authors: Chang, C.W., Thompson, C.V., Gan, C.L., Pey, K.L., Choi, W.K., Lim, Y.K.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/55778
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Institution: National University of Singapore
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Summary:10.1063/1.2714315

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