Effects of microvoids on the linewidth dependence of electromigration failure of dual-damascene copper interconnects

10.1063/1.2714315

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Bibliographic Details
Main Authors:	Chang, C.W., Thompson, C.V., Gan, C.L., Pey, K.L., Choi, W.K., Lim, Y.K.
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/55778
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Institution:	National University of Singapore

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spelling	sg-nus-scholar.10635-557782023-10-25T22:58:58Z Effects of microvoids on the linewidth dependence of electromigration failure of dual-damascene copper interconnects Chang, C.W. Thompson, C.V. Gan, C.L. Pey, K.L. Choi, W.K. Lim, Y.K. ELECTRICAL & COMPUTER ENGINEERING 10.1063/1.2714315 Applied Physics Letters 90 19 - APPLA 2014-06-17T02:47:01Z 2014-06-17T02:47:01Z 2007 Article Chang, C.W., Thompson, C.V., Gan, C.L., Pey, K.L., Choi, W.K., Lim, Y.K. (2007). Effects of microvoids on the linewidth dependence of electromigration failure of dual-damascene copper interconnects. Applied Physics Letters 90 (19) : -. ScholarBank@NUS Repository. https://doi.org/10.1063/1.2714315 00036951 http://scholarbank.nus.edu.sg/handle/10635/55778 000246413400093 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1063/1.2714315
author2	ELECTRICAL & COMPUTER ENGINEERING
author_facet	ELECTRICAL & COMPUTER ENGINEERING Chang, C.W. Thompson, C.V. Gan, C.L. Pey, K.L. Choi, W.K. Lim, Y.K.
format	Article
author	Chang, C.W. Thompson, C.V. Gan, C.L. Pey, K.L. Choi, W.K. Lim, Y.K.
spellingShingle	Chang, C.W. Thompson, C.V. Gan, C.L. Pey, K.L. Choi, W.K. Lim, Y.K. Effects of microvoids on the linewidth dependence of electromigration failure of dual-damascene copper interconnects
author_sort	Chang, C.W.
title	Effects of microvoids on the linewidth dependence of electromigration failure of dual-damascene copper interconnects
title_short	Effects of microvoids on the linewidth dependence of electromigration failure of dual-damascene copper interconnects
title_full	Effects of microvoids on the linewidth dependence of electromigration failure of dual-damascene copper interconnects
title_fullStr	Effects of microvoids on the linewidth dependence of electromigration failure of dual-damascene copper interconnects
title_full_unstemmed	Effects of microvoids on the linewidth dependence of electromigration failure of dual-damascene copper interconnects
title_sort	effects of microvoids on the linewidth dependence of electromigration failure of dual-damascene copper interconnects
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/55778
_version_	1781412188582313984

Effects of microvoids on the linewidth dependence of electromigration failure of dual-damascene copper interconnects

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