Effects of microvoids on the linewidth dependence of electromigration failure of dual-damascene copper interconnects
10.1063/1.2714315
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Main Authors: | Chang, C.W., Thompson, C.V., Gan, C.L., Pey, K.L., Choi, W.K., Lim, Y.K. |
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Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Article |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/55778 |
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Institution: | National University of Singapore |
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