Experimental characterization and modeling of the reliability of three-terminal dual-damascene Cu interconnect trees

Experimental characterization and modeling of the reliability of three-terminal dual-damascene Cu interconnect trees

10.1063/1.1585119

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Bibliographic Details
Main Authors: Gan, C.L., Thompson, C.V., Pey, K.L., Choi, W.K.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/55955
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Institution: National University of Singapore
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