Investigation of in situ trench etching process and Bosch process for fabricating high-aspect-ratio beams for microelectromechanical systems

10.1116/1.1501583

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書目詳細資料
Main Authors: Kok, K.W., Yoo, W.J., Sooriakumar, K., Pan, J.S., Lee, E.Y.
其他作者: ELECTRICAL & COMPUTER ENGINEERING
格式: Article
出版: 2014
在線閱讀:http://scholarbank.nus.edu.sg/handle/10635/56399
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機構: National University of Singapore