High-pressure phase transformation as the mechanism of ductile chip formation in nanoscale cutting of silicon wafer

High-pressure phase transformation as the mechanism of ductile chip formation in nanoscale cutting of silicon wafer

10.1243/09544054JEM901

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Bibliographic Details
Main Authors: Cai, M.B., Li, X.P., Rahman, M.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Hydrostatic pressure
Molecular dynamics simulation
Nanoscale ductile cutting
Phase transformation
Silicon
Online Access:http://scholarbank.nus.edu.sg/handle/10635/60449
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Institution: National University of Singapore
Description
Summary:10.1243/09544054JEM901

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