High-pressure phase transformation as the mechanism of ductile chip formation in nanoscale cutting of silicon wafer

10.1243/09544054JEM901

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Bibliographic Details
Main Authors:	Cai, M.B., Li, X.P., Rahman, M.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Hydrostatic pressure Molecular dynamics simulation Nanoscale ductile cutting Phase transformation Silicon
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/60449
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-60449
record_format	dspace
spelling	sg-nus-scholar.10635-604492023-11-01T07:18:48Z High-pressure phase transformation as the mechanism of ductile chip formation in nanoscale cutting of silicon wafer Cai, M.B. Li, X.P. Rahman, M. MECHANICAL ENGINEERING Hydrostatic pressure Molecular dynamics simulation Nanoscale ductile cutting Phase transformation Silicon 10.1243/09544054JEM901 Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture 221 10 1511-1519 PIBME 2014-06-17T06:23:21Z 2014-06-17T06:23:21Z 2007 Article Cai, M.B., Li, X.P., Rahman, M. (2007). High-pressure phase transformation as the mechanism of ductile chip formation in nanoscale cutting of silicon wafer. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture 221 (10) : 1511-1519. ScholarBank@NUS Repository. https://doi.org/10.1243/09544054JEM901 09544054 http://scholarbank.nus.edu.sg/handle/10635/60449 000250849500004 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Hydrostatic pressure Molecular dynamics simulation Nanoscale ductile cutting Phase transformation Silicon
spellingShingle	Hydrostatic pressure Molecular dynamics simulation Nanoscale ductile cutting Phase transformation Silicon Cai, M.B. Li, X.P. Rahman, M. High-pressure phase transformation as the mechanism of ductile chip formation in nanoscale cutting of silicon wafer
description	10.1243/09544054JEM901
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Cai, M.B. Li, X.P. Rahman, M.
format	Article
author	Cai, M.B. Li, X.P. Rahman, M.
author_sort	Cai, M.B.
title	High-pressure phase transformation as the mechanism of ductile chip formation in nanoscale cutting of silicon wafer
title_short	High-pressure phase transformation as the mechanism of ductile chip formation in nanoscale cutting of silicon wafer
title_full	High-pressure phase transformation as the mechanism of ductile chip formation in nanoscale cutting of silicon wafer
title_fullStr	High-pressure phase transformation as the mechanism of ductile chip formation in nanoscale cutting of silicon wafer
title_full_unstemmed	High-pressure phase transformation as the mechanism of ductile chip formation in nanoscale cutting of silicon wafer
title_sort	high-pressure phase transformation as the mechanism of ductile chip formation in nanoscale cutting of silicon wafer
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/60449
_version_	1781781843866025984

High-pressure phase transformation as the mechanism of ductile chip formation in nanoscale cutting of silicon wafer

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