The upper bound of tool edge radius for nanoscale ductile mode cutting of silicon wafer

10.1007/s00170-005-0245-0

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Bibliographic Details
Main Authors: Arefin, S., Li, X.P., Rahman, M., Liu, K.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/61533
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Institution: National University of Singapore
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