The upper bound of tool edge radius for nanoscale ductile mode cutting of silicon wafer

The upper bound of tool edge radius for nanoscale ductile mode cutting of silicon wafer

10.1007/s00170-005-0245-0

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Bibliographic Details
Main Authors: Arefin, S., Li, X.P., Rahman, M., Liu, K.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Cutting edge radius
Ductile mode cutting
Nanoscale
Silicon wafer
Online Access:http://scholarbank.nus.edu.sg/handle/10635/61533
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Institution: National University of Singapore

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