Front- and backside investigations of thermal and electronic properties of semiconducting devices
Microelectronics Reliability
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sg-nus-scholar.10635-622232015-02-26T11:01:29Z Front- and backside investigations of thermal and electronic properties of semiconducting devices Fiege, G.B.M. Schade, W. Palaniappan, M. Ng, V. Phang, J.C.H. Balk, L.J. ELECTRICAL ENGINEERING Microelectronics Reliability 39 6-7 937-940 MCRLA 2014-06-17T06:48:44Z 2014-06-17T06:48:44Z 1999-06 Article Fiege, G.B.M.,Schade, W.,Palaniappan, M.,Ng, V.,Phang, J.C.H.,Balk, L.J. (1999-06). Front- and backside investigations of thermal and electronic properties of semiconducting devices. Microelectronics Reliability 39 (6-7) : 937-940. ScholarBank@NUS Repository. 00262714 http://scholarbank.nus.edu.sg/handle/10635/62223 NOT_IN_WOS Scopus |
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Microelectronics Reliability |
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ELECTRICAL ENGINEERING |
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ELECTRICAL ENGINEERING Fiege, G.B.M. Schade, W. Palaniappan, M. Ng, V. Phang, J.C.H. Balk, L.J. |
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Fiege, G.B.M. Schade, W. Palaniappan, M. Ng, V. Phang, J.C.H. Balk, L.J. |
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Fiege, G.B.M. Schade, W. Palaniappan, M. Ng, V. Phang, J.C.H. Balk, L.J. Front- and backside investigations of thermal and electronic properties of semiconducting devices |
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Fiege, G.B.M. |
title |
Front- and backside investigations of thermal and electronic properties of semiconducting devices |
title_short |
Front- and backside investigations of thermal and electronic properties of semiconducting devices |
title_full |
Front- and backside investigations of thermal and electronic properties of semiconducting devices |
title_fullStr |
Front- and backside investigations of thermal and electronic properties of semiconducting devices |
title_full_unstemmed |
Front- and backside investigations of thermal and electronic properties of semiconducting devices |
title_sort |
front- and backside investigations of thermal and electronic properties of semiconducting devices |
publishDate |
2014 |
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http://scholarbank.nus.edu.sg/handle/10635/62223 |
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1681085736597585920 |