Front- and backside investigations of thermal and electronic properties of semiconducting devices

• Main Authors: Fiege, G.B.M., Schade, W., Palaniappan, M., Ng, V., Phang, J.C.H., Balk, L.J.
• Other Authors: ELECTRICAL ENGINEERING
• Format: Article
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/62223
• Institution: National University of Singapore

Microelectronics Reliability