Front- and backside investigations of thermal and electronic properties of semiconducting devices
Microelectronics Reliability
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Main Authors: | Fiege, G.B.M., Schade, W., Palaniappan, M., Ng, V., Phang, J.C.H., Balk, L.J. |
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Other Authors: | ELECTRICAL ENGINEERING |
Format: | Article |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/62223 |
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Institution: | National University of Singapore |
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