Front- and backside investigations of thermal and electronic properties of semiconducting devices

Front- and backside investigations of thermal and electronic properties of semiconducting devices

Microelectronics Reliability

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Bibliographic Details
Main Authors: Fiege, G.B.M., Schade, W., Palaniappan, M., Ng, V., Phang, J.C.H., Balk, L.J.
Other Authors: ELECTRICAL ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/62223
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/62223

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