Fabrication of wireless sensor platform on transparent flexible film using screen printing and via interconnect

Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010

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書目詳細資料
Main Authors: Shi, C.W.P., Shan, X., Tarapata, G., Jachhowicz, R., Lu, C.W., Hui, H.T.
其他作者: ELECTRICAL & COMPUTER ENGINEERING
格式: Conference or Workshop Item
出版: 2014
在線閱讀:http://scholarbank.nus.edu.sg/handle/10635/70283
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機構: National University of Singapore