Fabrication of wireless sensor platform on transparent flexible film using screen printing and via interconnect

• Main Authors: Shi, C.W.P., Shan, X., Tarapata, G., Jachhowicz, R., Lu, C.W., Hui, H.T.
• Other Authors: ELECTRICAL & COMPUTER ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/70283
• Institution: National University of Singapore

Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010