Fabrication of wireless sensor platform on transparent flexible film using screen printing and via interconnect
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010
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Main Authors: | Shi, C.W.P., Shan, X., Tarapata, G., Jachhowicz, R., Lu, C.W., Hui, H.T. |
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Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/70283 |
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Institution: | National University of Singapore |
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