Fabrication of wireless sensor platform on transparent flexible film using screen printing and via interconnect

Fabrication of wireless sensor platform on transparent flexible film using screen printing and via interconnect

Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010

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Bibliographic Details
Main Authors: Shi, C.W.P., Shan, X., Tarapata, G., Jachhowicz, R., Lu, C.W., Hui, H.T.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/70283
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Institution: National University of Singapore
Description
Summary:Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010

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