Localization of Cu/low-k interconnect reliability defects by pulsed laser induced technique

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Saved in:

Bibliographic Details
Main Authors:	Tan, T.L., Quah, A.C.T., Gan, C.L., Phang, J.C.H., Chua, C.M., Ng, C.M., Du, A.-Y.
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/70818
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

id	sg-nus-scholar.10635-70818
record_format	dspace
spelling	sg-nus-scholar.10635-708182015-02-15T05:54:58Z Localization of Cu/low-k interconnect reliability defects by pulsed laser induced technique Tan, T.L. Quah, A.C.T. Gan, C.L. Phang, J.C.H. Chua, C.M. Ng, C.M. Du, A.-Y. ELECTRICAL & COMPUTER ENGINEERING Conference Proceedings from the International Symposium for Testing and Failure Analysis 156-160 2014-06-19T03:16:37Z 2014-06-19T03:16:37Z 2007 Conference Paper Tan, T.L.,Quah, A.C.T.,Gan, C.L.,Phang, J.C.H.,Chua, C.M.,Ng, C.M.,Du, A.-Y. (2007). Localization of Cu/low-k interconnect reliability defects by pulsed laser induced technique. Conference Proceedings from the International Symposium for Testing and Failure Analysis : 156-160. ScholarBank@NUS Repository. 0871708639 http://scholarbank.nus.edu.sg/handle/10635/70818 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Conference Proceedings from the International Symposium for Testing and Failure Analysis
author2	ELECTRICAL & COMPUTER ENGINEERING
author_facet	ELECTRICAL & COMPUTER ENGINEERING Tan, T.L. Quah, A.C.T. Gan, C.L. Phang, J.C.H. Chua, C.M. Ng, C.M. Du, A.-Y.
format	Conference or Workshop Item
author	Tan, T.L. Quah, A.C.T. Gan, C.L. Phang, J.C.H. Chua, C.M. Ng, C.M. Du, A.-Y.
spellingShingle	Tan, T.L. Quah, A.C.T. Gan, C.L. Phang, J.C.H. Chua, C.M. Ng, C.M. Du, A.-Y. Localization of Cu/low-k interconnect reliability defects by pulsed laser induced technique
author_sort	Tan, T.L.
title	Localization of Cu/low-k interconnect reliability defects by pulsed laser induced technique
title_short	Localization of Cu/low-k interconnect reliability defects by pulsed laser induced technique
title_full	Localization of Cu/low-k interconnect reliability defects by pulsed laser induced technique
title_fullStr	Localization of Cu/low-k interconnect reliability defects by pulsed laser induced technique
title_full_unstemmed	Localization of Cu/low-k interconnect reliability defects by pulsed laser induced technique
title_sort	localization of cu/low-k interconnect reliability defects by pulsed laser induced technique
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/70818
_version_	1681087270189268992

Localization of Cu/low-k interconnect reliability defects by pulsed laser induced technique

Similar Items