Localization of Cu/low-k interconnect reliability defects by pulsed laser induced technique

• Main Authors: Tan, T.L., Quah, A.C.T., Gan, C.L., Phang, J.C.H., Chua, C.M., Ng, C.M., Du, A.-Y.
• Other Authors: ELECTRICAL & COMPUTER ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/70818
• Institution: National University of Singapore

Conference Proceedings from the International Symposium for Testing and Failure Analysis