Analysis of interfacial delamination in IC packaging: Use stress or fracture mechanics?
10.1109/EPTC.2009.5416480
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2014
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sg-nus-scholar.10635-731872015-01-30T11:41:54Z Analysis of interfacial delamination in IC packaging: Use stress or fracture mechanics? Guojun, H. Jing-En, L. Baraton, X. Tay, A.A.O. MECHANICAL ENGINEERING 10.1109/EPTC.2009.5416480 Proceedings of the Electronic Packaging Technology Conference, EPTC 584-590 2014-06-19T05:32:10Z 2014-06-19T05:32:10Z 2009 Conference Paper Guojun, H.,Jing-En, L.,Baraton, X.,Tay, A.A.O. (2009). Analysis of interfacial delamination in IC packaging: Use stress or fracture mechanics?. Proceedings of the Electronic Packaging Technology Conference, EPTC : 584-590. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/EPTC.2009.5416480" target="_blank">https://doi.org/10.1109/EPTC.2009.5416480</a> 9781424451005 http://scholarbank.nus.edu.sg/handle/10635/73187 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
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NUS Library |
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Singapore |
| collection |
ScholarBank@NUS |
| description |
10.1109/EPTC.2009.5416480 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Guojun, H. Jing-En, L. Baraton, X. Tay, A.A.O. |
| format |
Conference or Workshop Item |
| author |
Guojun, H. Jing-En, L. Baraton, X. Tay, A.A.O. |
| spellingShingle |
Guojun, H. Jing-En, L. Baraton, X. Tay, A.A.O. Analysis of interfacial delamination in IC packaging: Use stress or fracture mechanics? |
| author_sort |
Guojun, H. |
| title |
Analysis of interfacial delamination in IC packaging: Use stress or fracture mechanics? |
| title_short |
Analysis of interfacial delamination in IC packaging: Use stress or fracture mechanics? |
| title_full |
Analysis of interfacial delamination in IC packaging: Use stress or fracture mechanics? |
| title_fullStr |
Analysis of interfacial delamination in IC packaging: Use stress or fracture mechanics? |
| title_full_unstemmed |
Analysis of interfacial delamination in IC packaging: Use stress or fracture mechanics? |
| title_sort |
analysis of interfacial delamination in ic packaging: use stress or fracture mechanics? |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/73187 |
| _version_ |
1681087702217261056 |