Cohesive zone modeling of 3D delamination in encapsulated silicon devices

Cohesive zone modeling of 3D delamination in encapsulated silicon devices

10.1109/ECTC.2012.6249033

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Bibliographic Details
Main Authors: Ho, S.L., Joshi, S.P., Tay, A.A.O.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73253
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Institution: National University of Singapore
Description
Summary:10.1109/ECTC.2012.6249033

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