Cohesive zone modeling of 3D delamination in encapsulated silicon devices

10.1109/ECTC.2012.6249033

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Bibliographic Details
Main Authors:	Ho, S.L., Joshi, S.P., Tay, A.A.O.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73253
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-73253
record_format	dspace
spelling	sg-nus-scholar.10635-732532015-01-31T18:23:20Z Cohesive zone modeling of 3D delamination in encapsulated silicon devices Ho, S.L. Joshi, S.P. Tay, A.A.O. MECHANICAL ENGINEERING 10.1109/ECTC.2012.6249033 Proceedings - Electronic Components and Technology Conference 1493-1498 PECCA 2014-06-19T05:32:56Z 2014-06-19T05:32:56Z 2012 Conference Paper Ho, S.L.,Joshi, S.P.,Tay, A.A.O. (2012). Cohesive zone modeling of 3D delamination in encapsulated silicon devices. Proceedings - Electronic Components and Technology Conference : 1493-1498. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ECTC.2012.6249033" target="_blank">https://doi.org/10.1109/ECTC.2012.6249033</a> 9781467319669 05695503 http://scholarbank.nus.edu.sg/handle/10635/73253 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	10.1109/ECTC.2012.6249033
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Ho, S.L. Joshi, S.P. Tay, A.A.O.
format	Conference or Workshop Item
author	Ho, S.L. Joshi, S.P. Tay, A.A.O.
spellingShingle	Ho, S.L. Joshi, S.P. Tay, A.A.O. Cohesive zone modeling of 3D delamination in encapsulated silicon devices
author_sort	Ho, S.L.
title	Cohesive zone modeling of 3D delamination in encapsulated silicon devices
title_short	Cohesive zone modeling of 3D delamination in encapsulated silicon devices
title_full	Cohesive zone modeling of 3D delamination in encapsulated silicon devices
title_fullStr	Cohesive zone modeling of 3D delamination in encapsulated silicon devices
title_full_unstemmed	Cohesive zone modeling of 3D delamination in encapsulated silicon devices
title_sort	cohesive zone modeling of 3d delamination in encapsulated silicon devices
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73253
_version_	1681087714374451200

Cohesive zone modeling of 3D delamination in encapsulated silicon devices

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