Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging

Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging

10.1016/j.microrel.2005.06.009

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Bibliographic Details
Main Authors: Pan, M.Y., Gupta, M., Tay, A.A.O., Vaidyanathan, K.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73348
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Institution: National University of Singapore
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Summary:10.1016/j.microrel.2005.06.009

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