Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging

10.1016/j.microrel.2005.06.009

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Bibliographic Details
Main Authors:	Pan, M.Y., Gupta, M., Tay, A.A.O., Vaidyanathan, K.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73348
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Institution:	National University of Singapore

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spelling	sg-nus-scholar.10635-733482023-10-26T10:03:29Z Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging Pan, M.Y. Gupta, M. Tay, A.A.O. Vaidyanathan, K. MECHANICAL ENGINEERING 10.1016/j.microrel.2005.06.009 Microelectronics Reliability 46 5-6 763-767 MCRLA 2014-06-19T05:34:03Z 2014-06-19T05:34:03Z 2006-05 Conference Paper Pan, M.Y., Gupta, M., Tay, A.A.O., Vaidyanathan, K. (2006-05). Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging. Microelectronics Reliability 46 (5-6) : 763-767. ScholarBank@NUS Repository. https://doi.org/10.1016/j.microrel.2005.06.009 00262714 http://scholarbank.nus.edu.sg/handle/10635/73348 000236838500011 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1016/j.microrel.2005.06.009
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Pan, M.Y. Gupta, M. Tay, A.A.O. Vaidyanathan, K.
format	Conference or Workshop Item
author	Pan, M.Y. Gupta, M. Tay, A.A.O. Vaidyanathan, K.
spellingShingle	Pan, M.Y. Gupta, M. Tay, A.A.O. Vaidyanathan, K. Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging
author_sort	Pan, M.Y.
title	Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging
title_short	Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging
title_full	Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging
title_fullStr	Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging
title_full_unstemmed	Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging
title_sort	development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73348
_version_	1781783301421268992

Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging

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