Effect of presence of multi-walled carbon nanotubes on the creep properties of Sn-Ag-Cu solder

Effect of presence of multi-walled carbon nanotubes on the creep properties of Sn-Ag-Cu solder

10.1115/IMECE2006-13241

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Bibliographic Details
Main Authors: Nai, S.M.L., Wei, J., Gupta, M.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73397
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Institution: National University of Singapore
Description
Summary:10.1115/IMECE2006-13241

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