Effect of presence of multi-walled carbon nanotubes on the creep properties of Sn-Ag-Cu solder

10.1115/IMECE2006-13241

Saved in:
Bibliographic Details
Main Authors: Nai, S.M.L., Wei, J., Gupta, M.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73397
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore

Similar Items