Effect of presence of multi-walled carbon nanotubes on the creep properties of Sn-Ag-Cu solder
10.1115/IMECE2006-13241
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sg-nus-scholar.10635-733972015-01-17T04:18:15Z Effect of presence of multi-walled carbon nanotubes on the creep properties of Sn-Ag-Cu solder Nai, S.M.L. Wei, J. Gupta, M. MECHANICAL ENGINEERING 10.1115/IMECE2006-13241 American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP - EEAEE 2014-06-19T05:34:37Z 2014-06-19T05:34:37Z 2006 Conference Paper Nai, S.M.L.,Wei, J.,Gupta, M. (2006). Effect of presence of multi-walled carbon nanotubes on the creep properties of Sn-Ag-Cu solder. American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP : -. ScholarBank@NUS Repository. <a href="https://doi.org/10.1115/IMECE2006-13241" target="_blank">https://doi.org/10.1115/IMECE2006-13241</a> 0791837904 http://scholarbank.nus.edu.sg/handle/10635/73397 NOT_IN_WOS Scopus |
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MECHANICAL ENGINEERING |
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MECHANICAL ENGINEERING Nai, S.M.L. Wei, J. Gupta, M. |
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Conference or Workshop Item |
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Nai, S.M.L. Wei, J. Gupta, M. |
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Nai, S.M.L. Wei, J. Gupta, M. Effect of presence of multi-walled carbon nanotubes on the creep properties of Sn-Ag-Cu solder |
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Nai, S.M.L. |
title |
Effect of presence of multi-walled carbon nanotubes on the creep properties of Sn-Ag-Cu solder |
title_short |
Effect of presence of multi-walled carbon nanotubes on the creep properties of Sn-Ag-Cu solder |
title_full |
Effect of presence of multi-walled carbon nanotubes on the creep properties of Sn-Ag-Cu solder |
title_fullStr |
Effect of presence of multi-walled carbon nanotubes on the creep properties of Sn-Ag-Cu solder |
title_full_unstemmed |
Effect of presence of multi-walled carbon nanotubes on the creep properties of Sn-Ag-Cu solder |
title_sort |
effect of presence of multi-walled carbon nanotubes on the creep properties of sn-ag-cu solder |
publishDate |
2014 |
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http://scholarbank.nus.edu.sg/handle/10635/73397 |
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1681087740774449152 |