Effect of sub-micron alumina particulates on the properties of A Sn-0.7Cu lead-free solder alloy

Effect of sub-micron alumina particulates on the properties of A Sn-0.7Cu lead-free solder alloy

The Minerals, Metals and Materials Society - 3rd International Conference on Processing Materials for Properties 2008, PMP III

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Bibliographic Details
Main Authors: Zhong, X.L., Nai, S.M.L., Gupta, M.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Composite
Lead-free solder materials
Powder metallurgy
Tensile strength
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73403
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Institution: National University of Singapore
Description
Summary:The Minerals, Metals and Materials Society - 3rd International Conference on Processing Materials for Properties 2008, PMP III

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