Effect of sub-micron alumina particulates on the properties of A Sn-0.7Cu lead-free solder alloy

Effect of sub-micron alumina particulates on the properties of A Sn-0.7Cu lead-free solder alloy

The Minerals, Metals and Materials Society - 3rd International Conference on Processing Materials for Properties 2008, PMP III

Saved in:
Bibliographic Details
Main Authors: Zhong, X.L., Nai, S.M.L., Gupta, M.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Composite
Lead-free solder materials
Powder metallurgy
Tensile strength
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73403
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
id sg-nus-scholar.10635-73403
record_format dspace
spelling sg-nus-scholar.10635-734032015-01-17T12:56:08Z Effect of sub-micron alumina particulates on the properties of A Sn-0.7Cu lead-free solder alloy Zhong, X.L. Nai, S.M.L. Gupta, M. MECHANICAL ENGINEERING Composite Lead-free solder materials Powder metallurgy Tensile strength The Minerals, Metals and Materials Society - 3rd International Conference on Processing Materials for Properties 2008, PMP III 2 1016-1020 2014-06-19T05:34:41Z 2014-06-19T05:34:41Z 2009 Conference Paper Zhong, X.L.,Nai, S.M.L.,Gupta, M. (2009). Effect of sub-micron alumina particulates on the properties of A Sn-0.7Cu lead-free solder alloy. The Minerals, Metals and Materials Society - 3rd International Conference on Processing Materials for Properties 2008, PMP III 2 : 1016-1020. ScholarBank@NUS Repository. 9781615674237 http://scholarbank.nus.edu.sg/handle/10635/73403 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
topic Composite
Lead-free solder materials
Powder metallurgy
Tensile strength
spellingShingle Composite
Lead-free solder materials
Powder metallurgy
Tensile strength
Zhong, X.L.
Nai, S.M.L.
Gupta, M.
Effect of sub-micron alumina particulates on the properties of A Sn-0.7Cu lead-free solder alloy
description The Minerals, Metals and Materials Society - 3rd International Conference on Processing Materials for Properties 2008, PMP III
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Zhong, X.L.
Nai, S.M.L.
Gupta, M.
format Conference or Workshop Item
author Zhong, X.L.
Nai, S.M.L.
Gupta, M.
author_sort Zhong, X.L.
title Effect of sub-micron alumina particulates on the properties of A Sn-0.7Cu lead-free solder alloy
title_short Effect of sub-micron alumina particulates on the properties of A Sn-0.7Cu lead-free solder alloy
title_full Effect of sub-micron alumina particulates on the properties of A Sn-0.7Cu lead-free solder alloy
title_fullStr Effect of sub-micron alumina particulates on the properties of A Sn-0.7Cu lead-free solder alloy
title_full_unstemmed Effect of sub-micron alumina particulates on the properties of A Sn-0.7Cu lead-free solder alloy
title_sort effect of sub-micron alumina particulates on the properties of a sn-0.7cu lead-free solder alloy
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/73403
_version_ 1681087741853433856

Similar Items