Effect of sub-micron alumina particulates on the properties of A Sn-0.7Cu lead-free solder alloy
The Minerals, Metals and Materials Society - 3rd International Conference on Processing Materials for Properties 2008, PMP III
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Main Authors: | Zhong, X.L., Nai, S.M.L., Gupta, M. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/73403 |
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Institution: | National University of Singapore |
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