Effects of ball pad configuration on joint reliability in BGA chip-scale packages
Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
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2014
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sg-nus-scholar.10635-734092015-04-02T16:55:53Z Effects of ball pad configuration on joint reliability in BGA chip-scale packages Chong, V. Kheng, L.T. Teck, L.C. Gunawan, D.K. MECHANICAL ENGINEERING Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 735-739 2014-06-19T05:34:46Z 2014-06-19T05:34:46Z 2004 Conference Paper Chong, V.,Kheng, L.T.,Teck, L.C.,Gunawan, D.K. (2004). Effects of ball pad configuration on joint reliability in BGA chip-scale packages. Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 : 735-739. ScholarBank@NUS Repository. 0780388216 http://scholarbank.nus.edu.sg/handle/10635/73409 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| description |
Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Chong, V. Kheng, L.T. Teck, L.C. Gunawan, D.K. |
| format |
Conference or Workshop Item |
| author |
Chong, V. Kheng, L.T. Teck, L.C. Gunawan, D.K. |
| spellingShingle |
Chong, V. Kheng, L.T. Teck, L.C. Gunawan, D.K. Effects of ball pad configuration on joint reliability in BGA chip-scale packages |
| author_sort |
Chong, V. |
| title |
Effects of ball pad configuration on joint reliability in BGA chip-scale packages |
| title_short |
Effects of ball pad configuration on joint reliability in BGA chip-scale packages |
| title_full |
Effects of ball pad configuration on joint reliability in BGA chip-scale packages |
| title_fullStr |
Effects of ball pad configuration on joint reliability in BGA chip-scale packages |
| title_full_unstemmed |
Effects of ball pad configuration on joint reliability in BGA chip-scale packages |
| title_sort |
effects of ball pad configuration on joint reliability in bga chip-scale packages |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/73409 |
| _version_ |
1681087742934515712 |