Effects of ball pad configuration on joint reliability in BGA chip-scale packages
Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
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Main Authors: | Chong, V., Kheng, L.T., Teck, L.C., Gunawan, D.K. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
|
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/73409 |
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Institution: | National University of Singapore |
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