Effects of ball pad configuration on joint reliability in BGA chip-scale packages

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

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Bibliographic Details
Main Authors:	Chong, V., Kheng, L.T., Teck, L.C., Gunawan, D.K.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73409
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Institution:	National University of Singapore

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