Fatigue life estimation of a Stretched-Solder-Column ultra-fine-pitch wafer level package using the macro-micro modelling approach

Fatigue life estimation of a Stretched-Solder-Column ultra-fine-pitch wafer level package using the macro-micro modelling approach

Proceedings - Electronic Components and Technology Conference

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Bibliographic Details
Main Authors: Chng, A.C., Tay, A.A.O., Lim, K.M., Wong, E.H.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73464
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Institution: National University of Singapore
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Summary:Proceedings - Electronic Components and Technology Conference

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