Fatigue life estimation of a Stretched-Solder-Column ultra-fine-pitch wafer level package using the macro-micro modelling approach

• Main Authors: Chng, A.C., Tay, A.A.O., Lim, K.M., Wong, E.H.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/73464
• Institution: National University of Singapore

Proceedings - Electronic Components and Technology Conference