Fatigue life estimation of a Stretched-Solder-Column ultra-fine-pitch wafer level package using the macro-micro modelling approach

Fatigue life estimation of a Stretched-Solder-Column ultra-fine-pitch wafer level package using the macro-micro modelling approach

Proceedings - Electronic Components and Technology Conference

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Main Authors: Chng, A.C., Tay, A.A.O., Lim, K.M., Wong, E.H.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73464
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-734642015-02-21T02:11:52Z Fatigue life estimation of a Stretched-Solder-Column ultra-fine-pitch wafer level package using the macro-micro modelling approach Chng, A.C. Tay, A.A.O. Lim, K.M. Wong, E.H. MECHANICAL ENGINEERING Proceedings - Electronic Components and Technology Conference 2 1586-1591 PECCA 2014-06-19T05:35:25Z 2014-06-19T05:35:25Z 2004 Conference Paper Chng, A.C.,Tay, A.A.O.,Lim, K.M.,Wong, E.H. (2004). Fatigue life estimation of a Stretched-Solder-Column ultra-fine-pitch wafer level package using the macro-micro modelling approach. Proceedings - Electronic Components and Technology Conference 2 : 1586-1591. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/73464 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description Proceedings - Electronic Components and Technology Conference
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Chng, A.C.
Tay, A.A.O.
Lim, K.M.
Wong, E.H.
format Conference or Workshop Item
author Chng, A.C.
Tay, A.A.O.
Lim, K.M.
Wong, E.H.
spellingShingle Chng, A.C.
Tay, A.A.O.
Lim, K.M.
Wong, E.H.
Fatigue life estimation of a Stretched-Solder-Column ultra-fine-pitch wafer level package using the macro-micro modelling approach
author_sort Chng, A.C.
title Fatigue life estimation of a Stretched-Solder-Column ultra-fine-pitch wafer level package using the macro-micro modelling approach
title_short Fatigue life estimation of a Stretched-Solder-Column ultra-fine-pitch wafer level package using the macro-micro modelling approach
title_full Fatigue life estimation of a Stretched-Solder-Column ultra-fine-pitch wafer level package using the macro-micro modelling approach
title_fullStr Fatigue life estimation of a Stretched-Solder-Column ultra-fine-pitch wafer level package using the macro-micro modelling approach
title_full_unstemmed Fatigue life estimation of a Stretched-Solder-Column ultra-fine-pitch wafer level package using the macro-micro modelling approach
title_sort fatigue life estimation of a stretched-solder-column ultra-fine-pitch wafer level package using the macro-micro modelling approach
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/73464
_version_ 1681087753038594048

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