Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications

Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Saved in:
Bibliographic Details
Main Authors: Jayaganthan, R., Mohankumar, K., Tay, A.A.O., Kripesh, V.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73482
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
Description
Summary:Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Similar Items