Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

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Main Authors:	Jayaganthan, R., Mohankumar, K., Tay, A.A.O., Kripesh, V.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73482
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-73482
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spelling	sg-nus-scholar.10635-734822015-01-05T20:17:42Z Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications Jayaganthan, R. Mohankumar, K. Tay, A.A.O. Kripesh, V. MECHANICAL ENGINEERING Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 620-624 2014-06-19T05:35:38Z 2014-06-19T05:35:38Z 2004 Conference Paper Jayaganthan, R.,Mohankumar, K.,Tay, A.A.O.,Kripesh, V. (2004). Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications. Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 : 620-624. ScholarBank@NUS Repository. 0780388216 http://scholarbank.nus.edu.sg/handle/10635/73482 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Jayaganthan, R. Mohankumar, K. Tay, A.A.O. Kripesh, V.
format	Conference or Workshop Item
author	Jayaganthan, R. Mohankumar, K. Tay, A.A.O. Kripesh, V.
spellingShingle	Jayaganthan, R. Mohankumar, K. Tay, A.A.O. Kripesh, V. Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications
author_sort	Jayaganthan, R.
title	Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications
title_short	Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications
title_full	Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications
title_fullStr	Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications
title_full_unstemmed	Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications
title_sort	fractal analysis of sn-ag, sn-ag-cu, sn-ag-bi interfacial morphology in flipchip packaging applications
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73482
_version_	1681087756347899904

Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications

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