High frequency characterization of 100 micron pitch wafer level package interconnects
Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
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sg-nus-scholar.10635-735032015-02-20T03:19:58Z High frequency characterization of 100 micron pitch wafer level package interconnects Jayabalan, J. Rotaru, M.D. MECHANICAL ENGINEERING Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 1 171-174 2014-06-19T05:35:54Z 2014-06-19T05:35:54Z 2005 Conference Paper Jayabalan, J.,Rotaru, M.D. (2005). High frequency characterization of 100 micron pitch wafer level package interconnects. Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 1 : 171-174. ScholarBank@NUS Repository. 0780395786 http://scholarbank.nus.edu.sg/handle/10635/73503 NOT_IN_WOS Scopus |
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Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 |
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MECHANICAL ENGINEERING |
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MECHANICAL ENGINEERING Jayabalan, J. Rotaru, M.D. |
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Conference or Workshop Item |
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Jayabalan, J. Rotaru, M.D. |
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Jayabalan, J. Rotaru, M.D. High frequency characterization of 100 micron pitch wafer level package interconnects |
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Jayabalan, J. |
title |
High frequency characterization of 100 micron pitch wafer level package interconnects |
title_short |
High frequency characterization of 100 micron pitch wafer level package interconnects |
title_full |
High frequency characterization of 100 micron pitch wafer level package interconnects |
title_fullStr |
High frequency characterization of 100 micron pitch wafer level package interconnects |
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High frequency characterization of 100 micron pitch wafer level package interconnects |
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high frequency characterization of 100 micron pitch wafer level package interconnects |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/73503 |
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