High frequency characterization of 100 micron pitch wafer level package interconnects

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

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Bibliographic Details
Main Authors: Jayabalan, J., Rotaru, M.D.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73503
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-735032015-02-20T03:19:58Z High frequency characterization of 100 micron pitch wafer level package interconnects Jayabalan, J. Rotaru, M.D. MECHANICAL ENGINEERING Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 1 171-174 2014-06-19T05:35:54Z 2014-06-19T05:35:54Z 2005 Conference Paper Jayabalan, J.,Rotaru, M.D. (2005). High frequency characterization of 100 micron pitch wafer level package interconnects. Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 1 : 171-174. ScholarBank@NUS Repository. 0780395786 http://scholarbank.nus.edu.sg/handle/10635/73503 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Jayabalan, J.
Rotaru, M.D.
format Conference or Workshop Item
author Jayabalan, J.
Rotaru, M.D.
spellingShingle Jayabalan, J.
Rotaru, M.D.
High frequency characterization of 100 micron pitch wafer level package interconnects
author_sort Jayabalan, J.
title High frequency characterization of 100 micron pitch wafer level package interconnects
title_short High frequency characterization of 100 micron pitch wafer level package interconnects
title_full High frequency characterization of 100 micron pitch wafer level package interconnects
title_fullStr High frequency characterization of 100 micron pitch wafer level package interconnects
title_full_unstemmed High frequency characterization of 100 micron pitch wafer level package interconnects
title_sort high frequency characterization of 100 micron pitch wafer level package interconnects
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/73503
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