Impact life prediction modeling of TFBGA packages under board level drop test

Impact life prediction modeling of TFBGA packages under board level drop test

10.1016/j.microrel.2004.03.005

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Bibliographic Details
Main Authors: Tee, T.Y., Ng, H.S., Lim, C.T., Pek, E., Zhong, Z.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73523
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Institution: National University of Singapore
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Summary:10.1016/j.microrel.2004.03.005

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