Impact life prediction modeling of TFBGA packages under board level drop test

10.1016/j.microrel.2004.03.005

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Main Authors:	Tee, T.Y., Ng, H.S., Lim, C.T., Pek, E., Zhong, Z.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73523
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-73523
record_format	dspace
spelling	sg-nus-scholar.10635-735232024-11-11T22:05:22Z Impact life prediction modeling of TFBGA packages under board level drop test Tee, T.Y. Ng, H.S. Lim, C.T. Pek, E. Zhong, Z. MECHANICAL ENGINEERING 10.1016/j.microrel.2004.03.005 Microelectronics Reliability 44 7 1131-1142 MCRLA 2014-06-19T05:36:08Z 2014-06-19T05:36:08Z 2004-07 Conference Paper Tee, T.Y., Ng, H.S., Lim, C.T., Pek, E., Zhong, Z. (2004-07). Impact life prediction modeling of TFBGA packages under board level drop test. Microelectronics Reliability 44 (7) : 1131-1142. ScholarBank@NUS Repository. https://doi.org/10.1016/j.microrel.2004.03.005 00262714 http://scholarbank.nus.edu.sg/handle/10635/73523 000222675900015 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1016/j.microrel.2004.03.005
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Tee, T.Y. Ng, H.S. Lim, C.T. Pek, E. Zhong, Z.
format	Conference or Workshop Item
author	Tee, T.Y. Ng, H.S. Lim, C.T. Pek, E. Zhong, Z.
spellingShingle	Tee, T.Y. Ng, H.S. Lim, C.T. Pek, E. Zhong, Z. Impact life prediction modeling of TFBGA packages under board level drop test
author_sort	Tee, T.Y.
title	Impact life prediction modeling of TFBGA packages under board level drop test
title_short	Impact life prediction modeling of TFBGA packages under board level drop test
title_full	Impact life prediction modeling of TFBGA packages under board level drop test
title_fullStr	Impact life prediction modeling of TFBGA packages under board level drop test
title_full_unstemmed	Impact life prediction modeling of TFBGA packages under board level drop test
title_sort	impact life prediction modeling of tfbga packages under board level drop test
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73523
_version_	1821221645532004352

Impact life prediction modeling of TFBGA packages under board level drop test

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