Impact life prediction modeling of TFBGA packages under board level drop test
10.1016/j.microrel.2004.03.005
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Main Authors: | Tee, T.Y., Ng, H.S., Lim, C.T., Pek, E., Zhong, Z. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/73523 |
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Institution: | National University of Singapore |
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