Material synthesis routes for thin film bonding interfaces in reworkable and bumpless nano-interconnects

• Main Authors: Aggarwal, A.O., Raj, P.M., Abothu, I.R., Ravi, D., Sacks, M.D., Tay, A.A.O., Tummala, R.R.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/73587
• Institution: National University of Singapore

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces