Modeling adhesive failure in electronic packages

10.1109/EPTC.2006.342812

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Bibliographic Details
Main Authors:	Chew, H.B., Guo, T.F., Cheng, L.
Other Authors:	MATERIALS SCIENCE AND ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73625
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-73625
record_format	dspace
spelling	sg-nus-scholar.10635-736252015-01-16T21:03:45Z Modeling adhesive failure in electronic packages Chew, H.B. Guo, T.F. Cheng, L. MATERIALS SCIENCE AND ENGINEERING MECHANICAL ENGINEERING 10.1109/EPTC.2006.342812 Proceedings of the Electronic Packaging Technology Conference, EPTC 787-792 2014-06-19T05:37:22Z 2014-06-19T05:37:22Z 2006 Conference Paper Chew, H.B.,Guo, T.F.,Cheng, L. (2006). Modeling adhesive failure in electronic packages. Proceedings of the Electronic Packaging Technology Conference, EPTC : 787-792. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/EPTC.2006.342812" target="_blank">https://doi.org/10.1109/EPTC.2006.342812</a> 142440665X http://scholarbank.nus.edu.sg/handle/10635/73625 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	10.1109/EPTC.2006.342812
author2	MATERIALS SCIENCE AND ENGINEERING
author_facet	MATERIALS SCIENCE AND ENGINEERING Chew, H.B. Guo, T.F. Cheng, L.
format	Conference or Workshop Item
author	Chew, H.B. Guo, T.F. Cheng, L.
spellingShingle	Chew, H.B. Guo, T.F. Cheng, L. Modeling adhesive failure in electronic packages
author_sort	Chew, H.B.
title	Modeling adhesive failure in electronic packages
title_short	Modeling adhesive failure in electronic packages
title_full	Modeling adhesive failure in electronic packages
title_fullStr	Modeling adhesive failure in electronic packages
title_full_unstemmed	Modeling adhesive failure in electronic packages
title_sort	modeling adhesive failure in electronic packages
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73625
_version_	1681087782206832640

Modeling adhesive failure in electronic packages

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