Modeling adhesive failure in electronic packages

10.1109/EPTC.2006.342812

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Bibliographic Details
Main Authors:	Chew, H.B., Guo, T.F., Cheng, L.
Other Authors:	MATERIALS SCIENCE AND ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73625
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Institution:	National University of Singapore

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