Rate dependent interface delamination in plastic IC packages
10.1109/EPTC.2007.4469807
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2014
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sg-nus-scholar.10635-737972023-10-31T07:08:56Z Rate dependent interface delamination in plastic IC packages Tang, S. Guo, T.F. Cheng, L. MATERIALS SCIENCE AND ENGINEERING MECHANICAL ENGINEERING 10.1109/EPTC.2007.4469807 Proceedings of the Electronic Packaging Technology Conference, EPTC 680-685 2014-06-19T05:39:27Z 2014-06-19T05:39:27Z 2007 Conference Paper Tang, S., Guo, T.F., Cheng, L. (2007). Rate dependent interface delamination in plastic IC packages. Proceedings of the Electronic Packaging Technology Conference, EPTC : 680-685. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2007.4469807 1424413249 http://scholarbank.nus.edu.sg/handle/10635/73797 000253874600123 Scopus |
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10.1109/EPTC.2007.4469807 |
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MATERIALS SCIENCE AND ENGINEERING |
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MATERIALS SCIENCE AND ENGINEERING Tang, S. Guo, T.F. Cheng, L. |
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Conference or Workshop Item |
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Tang, S. Guo, T.F. Cheng, L. |
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Tang, S. Guo, T.F. Cheng, L. Rate dependent interface delamination in plastic IC packages |
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Tang, S. |
title |
Rate dependent interface delamination in plastic IC packages |
title_short |
Rate dependent interface delamination in plastic IC packages |
title_full |
Rate dependent interface delamination in plastic IC packages |
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Rate dependent interface delamination in plastic IC packages |
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Rate dependent interface delamination in plastic IC packages |
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rate dependent interface delamination in plastic ic packages |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/73797 |
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